Home / Application / Electronics / Chip bonding / Component assembly
Typical application
Bonding of chip or component assemblies on circuit boards.
Properties of the electrically conductive adhesives: Die bonding
- Various solvent-free one-and two-component epoxy resin systems with silver filler
- Processing with dispenser, printing or screen printing
- Short curing times at low temperatures
- Curing in reflow or forced-air oven
- High thermal stability and shock resistance
Properties of the thermally conductive adhesives: Sensor, thermocouple and chip bonding
- Adhesives with heat-conducting fillers
- High mechanical strength
- Good thermal stability and low thermal expansion
- Single- and two-component products
- Thermal curing, for example in reflow or forced-air oven
Properties of the non-conductive adhesives: SMD adhesives
- Bonding of subassemblies before soldering
- Short curing times with UV and/or heat
- Strong red colour for visual inspection
- Processing with dispenser, screen printing or needle transfer
Our product recommendation:
Vitralit® | 6138 | 5607 |
Typical applications
| Die-Attach, Heat sink bonding | SMD adhesive, bonding of electronuc devices prior soldering process |
Viscosity (mPas) | 150 - 170 | 100.000 - 200.000 |
Temperat.resist.(ºC) | -40 to +180 | -40 to +150 |
Curing | UV / thermal | 1 minute 160°C |
Colour | white | red |
Characteristics | high chemicals resistance, good heat conductivity, spacer 40µ | for optical control in red intensively adjusted , short curing time with UV and / or Heat, handling with Dispenser, Screen printing. |
Structalit | 5604 |
Typical applications
| SMD Klebstoff, Verkleben von Baugruppen vor dem Lötprozeß |
Base | 1K Epoxydharz |
Colour | rot |
Viscosity (mPas) | 25.000 - 40.000 |
Temp. resist. (ºC) | -40 / 180 |
Curing | 5 Min 120°C |
Pot life
| keine |
Characteristics | kurzen Aushärtezeiten mit Wärme, zur optischen Kontrolle intensiv rot eingestellt, Verarbeitung mit Dispenser, Siebdruck, Nadeltransfer |
Elecolit® | 6601 | 6603 |
Typical applications
| Heat sinks, sensors | Bonding magnets and heat sinks |
Base | 1K- Epoxy | Epoxy |
Viscosity (mPas) | 12000 - 20000 | 95000 - 115000 |
Curing | 20 Min./150°C | 20 Min./150°C |
Temperat.resist.(ºC) | -40/+200 | -40/+200 |
Hear conductivity (W/mK) | 1,05 | 1,3 |
Characteristics | Very good adhesion to metals, good flow behaviour, high strength, good dispensability | somewhat flexible, impact- and temperature resistant, high viscosity |
Brochure:
Video:
UV equipment
