Glob-top, chip encapsulation

Typical application

Glob-top: Protection of chip and bonding wires.

Properties of the adhesives

UV and thermally curing

  • Single-component epoxy resins, ion-free and thermally conductive
  • Good acid resistance, low water absorption
  • Frame & fill for components with small pitch spacing
  • Can be used wet-in-wet
  • Black products also available

 

Thermally curing

  • Protection of chips and bonding wire
  • Black single-component epoxy resins, thermally conductive
  • Good acid resistance, low water absorption

 

Our product recommendation:

Brochure:

 

Video:

UV equipment