Chip bonding, Component assembly

Typical application

Bonding of chip or component assemblies on circuit boards.

Properties of the electrically conductive adhesives: Die bonding

  • Various silver-filled, solvent-free one-and two-component epoxy resin systems
  • Processing with dispenser, printing or screen printing
  • Short curing times at low temperatures
  • Curing in reflow or forced-air oven
  • High thermal stability and shock resistance

 

Properties of the thermally conductive adhesives: Sensor, thermocouple and chip bonding

  • Adhesives with heat-conducting fillers
  • High mechanical strength
  • Good thermal stability and low thermal expansion
  • Single- and two-component products
  • Thermal curing, for example in reflow or forced-air oven

 

Properties of the non-conductive adhesives: SMD adhesives

  • Bonding of subassemblies before soldering
  • Short curing times with UV and/or heat
  • Strong red colour for visual inspection
  • Processing with dispenser, screen printing or needle transfer

 

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