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Typical application:
For components such as FCs, CSPs and FC BGAs for ASICs
Properties of the adhesives
- Excellent shock resistance, fast flow behaviour
- UV- and thermal curing
- Snap curing at low temperatures
- Storage stability 6 months at 5 °C, 2 months at 25 °C
- Low ion content – less than 10 ppm
- Nano fillers for very low CTE available!
Product recommendation:
Vitralit® | Vitralit® 2655 | Vitralit® 2665 | Vitralit® 2675 | Vitralit® 2685 |
Capillary flow
| very fast | fast | fast | medium |
Viscosity mPas | 200-400 | 3.000-5.000 | 1.500-2.500 | 20 - 30.000 |
min gap size
| 25µ | 25µ | 50µ | 80µ |
Tg °C | 35 | 90 | 130 | 150 |
Curing schedule
| 120°C 10 min, 150°C 5 min | 120°C 10 min, 150°C 5 min | 120°C 10 min, 150°C 5 min | 120°C 10 min, 150°C 5 min |
Curing schedule UV-A: 60mW/cm2 | 30 sec. Layer: 0,5mm | 120 sec. (>100mW/cm2) Layer: 1 mm | 60 sec. Layer: 0,5mm | 60 sec. Layer: 0,5mm |
Filler content % | - | 25 | 4,0 | 50 |
Filler size
| - | Nano < 100nm | <10µ | <10µ |
CTE | 90 ppm | 27ppm | <60 ppm | <50 ppm |
Shore D | 75 | 80 | 80 | 85 |
Modulus | 2,860 | 3,425 | 4,350 | 5,240 |
Product features
| Underfill for high mechanical reliability. Fast flow and snap cure for improved process time. | Lowest CTE based on Nano-filler. Highest reliability in avionics Temp. chock -55°C/+125°C Available Vi2660 (1000mPas) | high reliability requirements. Low CTE for improved thermal cycle perfomance for packages with small bump diameter. | Very low shrinkage. Ideal for sealing components, which are subject to a shock test. |
Brochure
Video:
UV equipment
