Glob-top, chip encapsulation
Typical application
Glob-top: Protection of chip and bonding wires.
Properties of the adhesives
UV and thermally curing
- Single-component epoxy resins, ion-free and thermally conductive
- Good acid resistance, low water absorption
- Frame & fill for components with small pitch spacing
- Can be used wet-in-wet
- Black products also available
Thermal curing
- Protection of chips and bonding wire
- Black single-component epoxy resins, thermally conductiveGood acid resistance, low water absorption
Our product recommendation:
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