Contact cards

Chip encapsulation

  • Protection of chips and bonding wire 
  • UV- and thermally curing single-component epoxy resins
  • Ion-free and thermally conductive
  • Good acid resistance, low water absorption,
  • Black products also available

 

Product recommendation

Frame & fill

  • For components with small pitch spacing 
  • Can be used wet-in-wet
  • Protection of chips and bonding wire 
  • UV- and thermally curing single-component epoxy resins
  • Ion-free and thermally conductive
  • Good acid resistance, low water absorption,
  • Black products also available

 

Product recommendation

Module bonding

  • Bonding flexible smart cards
  • Flexible cyanacrylates fluoresce for dispensed quantity inspection
  • Special film-forming substances prevent undesired running
  • Good bending strength and moisture-resistant

 

Product recommendation:

Brochures

 

Video:

UV equipment