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Steinbach site
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Application
Electronics
Component encapsulation
Conformal Coating
Chip bonding / Component assembly
Glob-top, chip encapsulation
Bonding instead of soldering
HF shielding
Heatsink bonding
Anisotropic bonding
PCB
Glob-top, chip encapsulation
Conformal coating
Chip bonding / Component assembly
Flip-chip underfill
Heatsink bonding
Anisotropic bonding
LCD
Glass Bonding Systems
Glass-glass edge bonding
Glass–glass surface bonding
Glass–metal bonds
Glue chipping – the innovation in decorative glass production
Structural bonding
Penloc® anaerobic adhesives
Penloc® GZ series – two-component structural adhesives
Penloc GT®x series – two-component-high-performance structural adhesives
Structalit®
Medical equipment
UV- and light-curing adhesives
High-speed adhesives
Smart card
Contact cards
Contactless cards
Plastics bonding
Large-area PMMA bonds
Bonding brackets
High-strength bonds
Bonding plastics without UV
Optics
Lens bonding
Fibre-optics
Products
Adhesives
Vitralit
Elecolit
Structalit
Penloc
Penloc anaerobic adhesives
Cyanolit
Cerastil
Inorganic adhesives
Anti-stick and anti-slag coating
Silicones
IMDS
Equipment
UV-equipment
Dispensing units
Dispensing units & controllers
Dispensing valves
Pressure vessels
Consumables
Dispensing gun
GTI machines
Hot bar soldering
Hot bar soldering systems,tray version
Hot bar soldering systems,rotary table version
XXL hot bar soldering systems, tray or rotary table version
Hot bar soldering systems,rotary table version
Heat sealing
Heat stacking
RoHS
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Honle - uv technology
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Dispensing units
Dispensing units & controllers
Dispensing valves
Pressure vessels
Consumables
Dispensing gun
GTI maschines
UV-equipment
Dispensing units
Hot bar soldering
Heat sealing
Heat stacking
RoHS